The XPedite6032 is a high-performance conduction- or air-cooled 3U CompactPCI (cPCI) module that dissipates less than 18 W and is capable of operating at up to 85°C at the external thermal interface without forced air flow (conduction-cooled version) or up to 55°C ambient air temperature with 300 LFM airflow (air-cooled version). The XPedite6032 can also host one single-width conduction-cooled PMC or standard air-cooled PMC. The XPedite6032 is tolerant of 40 g peak/6 ms half sine shock, random vibration of 0.1 g²/Hz from 50 to 2000 Hz, and swept sinusoidal vibration of 0.06 inch/10 g peak amplitude from 10 to 500 Hz.
The XPedite6032 utilizes the NXP (formerly Freescale) MPC7447A/7448 embedded processor and Marvell Discovery III system controller and provides up to 512 MB DDR-266 SDRAM, up to 128 MB of NOR flash, two RS-232/422 serial ports, a 33/66 MHz cPCI interface and 66/100/133 MHz PCI-X PMC interface. The serial and two Gigabit Ethernet interfaces are accessible through the backplane J2 connector along with a subset of the PMC’s P14 I/O. The XPedite6032 can be built as a system or peripheral cPCI module.
The XPedite6032 is ideal for 3U cPCI applications in commercial or extended temperature, shock, and vibration environments that require high-bandwidth and processing performance.
Technical Specs
Processor
- NXP (formerly Freescale) MPC7447A/7448
- 1 GHz max processor speed
- 133 MHz bus speed
- 32 kB L1 instruction/data caches
- 512 kB (7447A) / 1 MB (7448) L2 cache
Conduction-Cooled
- Operates at up to 85°C at the external thermal interface
Air-Cooled
- Operates at up to 55°C ambient air temperature with 300 LFM airflow
PCI-X PMC Slot
- Maximum aggregate bandwidth of 1 GB
- Processor PMC (PrPMC) support
Non-Volatile Storage
- Up to 128 MB NOR flash
- 4 kB SEEPROM
- 128 kB NVSRAM
Ethernet
- Two Gigabit Ethernet ports
- Rear I/O
DDR SDRAM
- Up to 512 MB at DDR-266
- 2.6 Gb/s peak bandwidth
Rear I/O
- Two Gigabit Ethernet ports
- Two RS-232/422 serial ports
- Four GPIO pins
- One I²C port
Software
- Linux BSP
- Wind River VxWorks BSP
- QNX Neutrino BSP
- Green Hills INTEGRITY BSP
- LynuxWorks LynxOS BSP
Physical Characteristics
- 3U cPCI form factor
- Dimensions: 100 mm x 160 mm
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
- Conformal coating available as an ordering option
Power Requirements (Estimate)
- 3.3 V, 5.2 A, 17.16 W
- 5 V, 0.05 A, 0.25 W
Accessories
Please contact X-ES Sales at
sales@xes-inc.com or by phone at
+1 (608) 833-1155 for information on this product's accessories.
Documentation
Datasheet
To view all of the information about this product in a PDF, please download the datasheet.
Download Datasheet
Technical Documents
SupportNet is your source for product manuals, technical support, and software downloads.
Access SupportNet
