XPedite7040

The XPedite7040 is a single-width, mid-size or full-size Advanced Mezzanine Card (AMC) single board computer designed to provide maximum performance and I/O options while minimizing power consumption. The Ultra Low Voltage (ULV) Intel® Core™ Duo processor or Low Voltage (LV) Intel® Core™2 Duo processor provides the XPedite7040 with a significant performance-per-watt processing advantage. Additionally, the Intel® 3100 chipset combines the functionality of an integrated server-class memory controller (Northbridge) and an I/O controller (Southbridge) into a single device that is specifically intended for power- and board-space-sensitive embedded applications.

The XPedite7040 can be installed in an AdvancedTCA (ATCA) AMC.0-compliant carrier or a MicroTCA.0 (µTCA)-compliant backplane. The XPedite7040 supports an AMC.1 x4 PCI Express interface, dual AMC.2 Gigabit Ethernet 1000BASE-BX interfaces, and dual AMC.3 SATA interfaces. Additional serial and GPIO is provided through the backplane connector.

The XPedite7040 supports two PC3200 SO-RDIMM modules and 4 GB of NAND flash for ample on-card memory capacity. Up to 4 MB of Firmware Hub (FWH) flash is also supported for redundant BIOS or OS kernel storage.

Features

• Intel® Core™ Duo or Intel® Core™2 Duo processor at up to 1.5 GHz
• Intel® 3100 chipset
• Front panel Gigabit Ethernet port
• Front panel RS-232 serial port
• Front panel USB 2.0 port
• Complies with AMC.0 and MicroTCA.0 (µTCA)
• AMC.1 x4 PCI Express interface
• AMC.2 dual Gigabit Ethernet 1000BASE-BX interfaces
• AMC.3 dual SATA interfaces
• Two PC3200 SO-RDIMMs, up to 8 GB
• 4 GB of NAND flash
• Up to 4 MB of Firmware Hub (FWH) storage
• AMI BIOS
• Linux BSP
• Wind River VxWorks BSP
• QNX Neutrino BSP
• Green Hills INTEGRITY BSP
• Microsoft Windows drivers

Technical Specs

Processor

• Intel® Core™ Duo or Intel® Core™2 Duo processor
• Up to 1.5 GHz
• Up to 4 MB L2 cache
• Up to 166 MHz (667 MT/s) FSB

Memory and I/O Controller Hub

• Intel® 3100
• DDR2-400 ECC SDRAM
• 4 GB of NAND flash
• Up to 4 MB of Firmware Hub (FWH) storage

AMC Backplane Interconnect

• Complies with AMC.0 and MicroTCA.0 (µTCA)
• AMC.1 x4 PCI Express interface
• AMC.2 dual Gigabit Ethernet 1000BASE-BX interfaces
• AMC.3 dual SATA interfaces
• Dual USB 2.0 interfaces
• RS-232/422 serial interface

Front Panel I/O

• Micro-DB-9, RS-232 serial port
• USB 2.0 port
• Gigabit Ethernet port

Software

• AMI BIOS
• Linux BSP
• Wind River VxWorks BSP
• QNX Neutrino BSP
• Green Hills INTEGRITY BSP
• Microsoft Windows drivers

Physical Characteristics

• Single-width, mid-size, or full-size AMC
• Dimensions: 180.6 mm x 73.5 mm

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

• Supported ruggedization levels (see the X-ES Ruggedization Chart): 1
• Conformal coating available as an ordering option

Power Requirements

Tested at 25°C ambient with 2 GB DDR2 and 1.2 GHz CPU

• Less than 30 W

Accessories

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

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Technical Documents

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