The XPedite7371 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the Intel® Core™ i7 processor. With two PCI Express P1 interconnects and two Gigabit Ethernet ports, the XPedite7371 is ideal for the high-bandwidth and processing-intensive applications of today’s military and avionics applications.
The XPedite7371 accommodates up to 4 GB of DDR3 ECC SDRAM in two channels to support memory-intensive applications. The XPedite7371 also hosts numerous I/O ports including Gigabit Ethernet, USB 2.0, SATA, graphics, and RS-232/422/485 through the backplane connectors.
The XPedite7371 can be used in either the system slot or peripheral slot of a VPX backplane. Operating system support for Wind River VxWorks, QNX Neutrino, and Linux Board Support Packages (BSPs) is available, as well as Microsoft Windows drivers.
Technical Specs
Processor
- Intel® Core™ i7 processor operating at 2.53, 2.0, 1.06, or 1.33 GHz
- Dual-core with Intel® Hyper-Threading Technology
- Intel® QM57 chipset
- Dual-channel integrated memory controller
- Integrated graphics controller
- 4 MB of shared cache
Memory
- Up to 4 GB of DDR3-1066 ECC SDRAM in two channels
- 32 MB of NOR boot flash
- Up to 16 GB of NAND flash
Graphics
- Integrated high-performance 3D graphics controller
- Dual DVI-D
VPX (VITA 46) P0 I/O
VPX (VITA 46) P1 I/O
- x4 PCI Express interface to P1.A
- x4 PCI Express interface to P1.B
- Two 1000BASE-BX Gigabit Ethernet ports (or one 10/100/1000BASE-T port to P1 and one port to P2)
- Two DVI graphics ports
- One audio port
VPX (VITA 46) P2 I/O
- One 10/100/1000BASE-T Ethernet port (optional)
- Two SATA ports capable of 3 Gb/s (optional)
- Two USB 2.0 ports (optional)
- Up to two RS-232/422/485 serial ports
- 3.3 V GPIO signals (optional)
- P64s PMC P14 I/O
XMC/PrPMC Site
- 32-bit, 33 MHz PCI bus (PMC interface)
- x8 PCIe port (XMC interface)
- P64s PMC P14 I/O
Software Support
- Wind River VxWorks BSP
- Linux BSP
- Microsoft Windows drivers
- GHS INTEGRITY BSP (contact factory)
- QNX Neutrino BSP (contact factory)
- LynuxWorks LynxOS BSP (contact factory)
Physical Characteristics
- 3U VPX-REDI conduction- or air-cooled form factor
- Dimensions: 100 mm x 160 mm
- 0.8 in. pitch without solder-side cover
- 0.85 and 1.0 in. pitch with solder-side cover
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
- Conformal coating available as an ordering option
Power Requirements
- Power will vary based on configuration and usage. Please consult factory.
Documentation
Datasheet
To view all of the information about this product in a PDF, please download the datasheet.
Download Datasheet
Technical Documents
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