The XPedite7501 is a high-performance, low-power, XMC module based on the 5th generation Intel® Core™ i7 Broadwell-H processor. With up to three PCI Express Gen3-capable ports and two Gigabit Ethernet ports, the XPedite7501 is ideal for high-bandwidth data processing applications.
Floating-Point-intensive applications such as radar, image processing, and signals intelligence will benefit from the performance boost provided by the Intel® Advanced Vector Extensions 2.0 (Intel® AVX2).
The XPedite7501 accommodates up to 8 GB of DDR3L-1600 ECC SDRAM in two channels to support memory-intensive applications and hosts numerous I/O ports, including Gigabit Ethernet, USB, SATA, graphics, and RS-232/422/485. The XPedite7501 leverages Intel® Iris™ Pro graphics for graphics-intensive applications and serves as a general-purpose GPU for demanding data processing applications.
Wind River VxWorks and Linux Board Support Packages (BSPs) are available, as well as Microsoft Windows drivers.
Technical Specs
Processor
- 5th generation Intel® Core™ i7 (Broadwell-H)
- 4th generation Intel® Core™ i7 (Haswell)
- Integrated high-performance 3D graphics controller
- Up to Intel® Iris™ Pro Graphics 6200
Memory
- Up to 8 GB of DDR3L-1600 ECC SDRAM in two channels
- Up to 32 GB of NAND flash
- 64 MB NOR boot flash
- 64 kB EEPROM
P14 PMC Interface
- Two USB 2.0 ports
- Two RS-232/422/485 ports
- Two 10/100/1000BASE-T Ethernet ports
- Four 3.3 V GPIO signals
P15 XMC Interface
- One x8 or two x4 PCI Express Gen3-capable links
- Four 3.3 V GPIO signals
P16 XMC Interface
- HDMI/DVI-D or Dual-Mode DisplayPort
- Two USB 2.0 ports
- Two SATA ports capable of 6 Gb/s
- One x4 PCI Express Gen3-capable link
Additional Features
- Non-volatile memory write protection
- Optional Trusted Platform Module (TPM)
- IEEE 1588 support on one Gigabit Ethernet port
- Intel® Active Management Technology (AMT) supported by Intel® vPro™ Technology
Software Support
- Wind River VxWorks BSP
- Linux BSP
- Microsoft Windows drivers
- Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs
Physical Characteristics
- XMC form factor
- Dimensions: 149 mm x 74 mm, 10 mm stacking height
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
- Conformal coating available as an ordering option
- Thermal performance will vary based on CPU frequency and application
Power Requirements
- Power will vary based on configuration and usage. Please consult factory.
Documentation
Datasheet
To view all of the information about this product in a PDF, please download the datasheet.
Download Datasheet
Technical Documents
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