3rd Generation Intel® Core™ i7 Processor Technology
3rd Gen Intel® Core™ i7
Designed for Rugged, Secure Performance
X-ES 3rd Gen Intel® Core™ i7 (formerly Ivy Bridge) processor boards bring unrivaled processing performance, in even the most rugged environments and applications.
Including features like PCI Express Fat Pipe P1 interconnects, Gigabit Ethernet, integrated dual-redundant MIL-STD-1553B interface, and CAN bus channels, X-ES Intel® Core™ i7 boards are able to maximize native I/O while minimizing SWaP and cost concerns.
Scalable, Expandable, and Customizable Solutions
X-ES 3rd Gen Intel® Core™ i7 (formerly Ivy Bridge) processor boards provide numerous I/O interfaces through the backplane connectors, including Gigabit Ethernet ports, USB 2.0 ports, SATA, graphics, and RS-232/422/485 serial ports, and are able to support additional expansion from an integrated XMC/PMC site.
Based on industry-standard form factors, such as VPX, COM Express®, and CompactPCI, X-ES Intel® Core™ i7 boards provide a dependable framework for any embedded system, along with X-ES’ comprehensive obsolescence and life cycle management services.
Featured 3rd Gen Intel® Core™ i7 Products
XPedite7472
3U VPX-REDI high-performance, secure SBC that features integrated SecureCOTS technology.
XCalibur4440
6U VPX, multiprocessing single board computer ideally suited for Small Form Factor systems.