Introducing Intel® Xeon Ice Lake-D
Intel® has unveiled their eagerly awaited Xeon® D-1700 and D-2700 series processors: a new line of power-efficient System-on-Chip (SoC) packages with integrated 100 Gigabit Ethernet providing incredible speed and exceptional networking performance in extreme environments.
Extreme Performance
Intel® Xeon®
D-1700 and D-2700
Formerly codenamed Ice Lake-D, Xeon® D-1700 and D-2700 series processors are power-efficient System-on-Chip (SoC) packages with integrated 100 Gigabit Ethernet for high-speed connectivity.
Offering significant improvements over existing Xeon® D processors in terms of sheer processing power and memory density, Ice Lake-D technology is ideal for computationally heavy applications.
With native temperature support between -40˚C and up to 85˚C and featuring high-density BGA packages, these processors are built to support rugged applications in more diverse conditions than ever before.
Advanced Features
Designed for Deployable Applications
100 Gigabit Ethernet
Integrated support for multiple lanes
of 100 Gigabit Ethernet supports high-performance networking and maximizes processor throughput capabilities.
Native Extended Temperature
With native temperature support between -40°C and 85°C, these processors are built for deployable applications in thermally challenging, diverse conditions.
Up to 20 Cores
More powerful than ever before with up to 20 cores and 64 GB of DDR4 memory in four channels, Intel® Xeon Ice Lake-D processor-based boards are the ultimate in embedded computing performance.
Microsemi PolarFire SoC FPGA
X-ES' Intel® Xeon® Ice Lake-D processor boards use the enhanced security features offered by Microsemi PolarFire SoC FPGA to support our SecureCOTS™ technology framework.
Ruggedized Design
A solderable BGA package provides enhanced vibration protection in addition to using industrial-grade parts for long product life cycles to support mission-critical applications.
Configurable XMC Site
With highly configurable expansion capabilities and remarkable I/O throughput, optional XMC capabilities offer tremendous growth potential for the systems they're integrated with.
Low Core Count (LCC)
X-ES processor boards featuring the Intel® Xeon® D-1700 series products offer optimized computing performance with up to 10 processor cores and up to 48 GB of DDR4 memory in three channels all in one, easy-to-cool package.
In addition to highly capable 100 Gigabit Ethernet and dual 10 Gigabit Ethernet, X-ES' LCC processor-based boards provide an XMC site and a Microsemi PolarFire SoC FPGA for hosting custom functions - ideal when stringent security capabilities are required.
Native extended temperature support from -40°C to 85°C allows embedded applications utilizing these Intel® Xeon® D processors to excel in thermally challenging environments.
High Core Count (HCC)
The X-ES line of Intel® Xeon® D-2700 series processor-based boards provide maximum computing power with up to 20 cores for high-performance networking.
Supercharge compact, deployable systems with processor boards offering the full capability provided by the HCC processors, with 100 Gigabit Ethernet ports and up to 64 GB of DDR4 memory in four channels.
Integrated SecureCOTS™ technology is available with the Microsemi PolarFire FPGA. Native extended temperature support from -40°C to 85°C allows embedded applications utilizing these Intel® Xeon® D processors to excel in thermally challenging environments.
Industry-Standard
Form Factors
X-ES integrates Intel® Xeon® D-1700 (LCC) and D-2700 (HCC) series processors into a variety of standard and custom form factors.
Speak to an Intel® Xeon® D Expert
Experience the most capable, most ruggedized embedded computing processor boards available on the market today.
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