Products
Development Systems
Rapid development systems from X-ES simplify and streamline the development process to enable projects to get started quickly. Configured with COTS boards specific to your application and a Board Support Package (BSP) backed by a highly-responsive team of support engineers, system development has never been easier.
Showing all 12 results
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XTend3103
Form Factor: PMC, XMC
Chassis Type: Development
Number of Slots: 2
Dimensions: 10.8"L x 9.3"W x 2.0"H
Chassis Cooling: Forced Convection-CooledDual XMC/PMC Carrier for Development and Testing
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XTend3100
Form Factor: PMC, XMC
Chassis Type: Development
Number of Slots: 2
Dimensions: 10.8"L x 9.3"W x 2.0"H
Chassis Cooling: Forced Convection-CooledDual XMC/PrPMC Carrier for Development and Testing
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XPand9004
Form Factor: Custom
Chassis Type: Custom
Number of Slots: 1
Dimensions: 5.8"L x 3.5"W x 1.1"H
Chassis Cooling: Natural Convection-CooledSolid-State Drive Module Development System
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XPand1405
Form Factor: COM Express®, PCIe Edge Card
Chassis Type: Development
Number of Slots: 1
Dimensions: 19.3"L x 15.43"W x 8.15"H
Chassis Cooling: Forced Convection-CooledDevelopment Platform for X-ES COM Express® Basic (Type 7) Modules
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XPand1404
Form Factor: COM Express®, PCIe Edge Card
Chassis Type: Development
Number of Slots: 1
Dimensions: 19.3"L x 15.43"W x 8.15"H
Chassis Cooling: Forced Convection-CooledDevelopment Platform for X-ES COM Express® Basic (Type 7) Modules
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XPand1400 Series
Form Factor: COM Express®, PCIe Edge Card, PMC, XMC
Chassis Type: Development
Number of Slots: 2
Dimensions: 21.5"L x 9"W x 20.5"H
Chassis Cooling: Forced Convection-CooledDevelopment Platform For XPand6000 Series, X-ES COM Express® Modules, and XMC/PMC Modules
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XPand1303
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.6"L x 13.5"W x 13.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX Development Platform for Up to Eight Air-Cooled Modules
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XPand1205
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.5"L x 5.5"W x 16.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
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XPand1203
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.5"L x 5.5"W x 16.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
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XPand1015
Form Factor: 6U VPX
Chassis Type: Development
Number of Slots: 2
Dimensions: 17.5"L x 5.6"W x 9.3"H
Chassis Cooling: Conduction-CooledTwo-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
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XPand1011
Form Factor: 6U VPX
Chassis Type: Development
Number of Slots: 2
Dimensions: 17.5"L x 5.6"W x 9.3"H
Chassis Cooling: Forced Convection-CooledTwo-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
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XPand1007
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 2
Dimensions: 11.9"L x 5.6"W x 9.3"H
Chassis Cooling: Conduction-CooledTwo-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
End of Life Systems
Looking for End of Life (EOL) and Not Recommended for New Designs (NRND) products?