Products
COM Express® Development Systems
X-ES provides COM Express® development systems for X-ES COM Express® mezzanines and the COM Express® XPand6000 Series rugged system. These air-cooled enable early development and rapid prototyping, and provide a convenient desktop setup with standard I/O connectors to simplify the transition from development to target system.
Showing all 3 results
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XPand1405
Form Factor: COM Express®, PCIe Edge Card
Chassis Type: Development
Number of Slots: 1
Dimensions: 19.3"L x 15.43"W x 8.15"H
Chassis Cooling: Forced Convection-CooledDevelopment Platform for X-ES COM Express® Basic (Type 7) Modules
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XPand1404
Form Factor: COM Express®, PCIe Edge Card
Chassis Type: Development
Number of Slots: 1
Dimensions: 19.3"L x 15.43"W x 8.15"H
Chassis Cooling: Forced Convection-CooledDevelopment Platform for X-ES COM Express® Basic (Type 7) Modules
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XPand1400 Series
Form Factor: COM Express®, PCIe Edge Card, PMC, XMC
Chassis Type: Development
Number of Slots: 2
Dimensions: 21.5"L x 9"W x 20.5"H
Chassis Cooling: Forced Convection-CooledDevelopment Platform For XPand6000 Series, X-ES COM Express® Modules, and XMC/PMC Modules
End of Life Systems
Looking for End of Life (EOL) and Not Recommended for New Designs (NRND) products?