XPedite2400

The XPedite2400 is a high-performance, reconfigurable, conduction- or air-cooled XMC module based on the AMD (formerly Xilinx) Virtex-7 family of FPGAs. With a x8 PCI Express interface, external memory, and flexible, high-density I/O, the XPedite2400 is ideal for customizable, high-bandwidth, data-processing applications.

The XPedite2400 provides a high-performance, feature-rich solution capable of interfacing to and processing streaming data from a wide variety of sensors. The X-ES FPGA Development Kit (FDK) is provided to support the requirements of high-performance, real-time, embedded streaming data applications and simplify FPGA development. It includes IP blocks, example FPGA designs, and software to control and communicate with FPGAs. A Linux Software Development Kit (SDK) is available.

Features

• AMD (formerly Xilinx) Virtex-7 FPGA XC7VX690T
• Conduction- or air-cooled XMC module
• Up to 4 GB of DDR3 SDRAM in two channels
• 128 MB of user NOR configuration flash
• Non-volatile FPGA configuration flash
• x8 PCI Express Gen3 on P15
• x8 GTX transceivers on P16
• Up to 32 LVDS / 64 single-ended I/O on P14
• Up to 19 LVDS / 38 single-ended I/O on P16
• X-ES FPGA Development Kit (FDK) is available
• Linux driver support for FDK

Technical Specs

FPGA

• AMD (formerly Xilinx) Virtex-7 for high-performance logic and DSP applications
• Standard FPGA is Virtex-7 XC7VX690T

Additionally Supported FPGAs

• Virtex-7 XC7VX330T
• Virtex-7 XC7VX415T
• Virtex-7 XC7VX485T
• Support for commercial and industrial temperature as well as -1, -2, -3 speed grades

Memory

• Up to 4 GB of DDR3 SDRAM in two 64-bit channels
• 128 MB of user NOR flash

XMC Interface

• x8 PCI Express port
• Four GPIO via I²C expander

P14 User I/O

• 32 FPGA differential/LVDS user I/O

P16 I/O

• Eight GTX transceivers
• 19 LVDS
• May be used as x8 PCI Express

Software

• X-ES FPGA Development Kit (FDK)
• Linux support

Physical Characteristics

• XMC conduction- or air-cooled form factor
• Dimensions: 149 mm x 74 mm

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

• Supported ruggedization levels (see the X-ES Ruggedization Chart): 3, 5
• Conformal coating available as an ordering option

Power Requirements

• Power will vary based on configuration and usage. Please consult factory.

Accessories

• XTend210 (90071260) - Debug Module for FPGA Cards
• XTend3100 (90050115) - Dual XMC/PrPMC Carrier for Development and Testing

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

Download Datasheet

Technical Documents

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