The XPand4200 Series redefines the limits of power, performance, and functionality in a sub-½ ATR chassis. This forced-air-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810F/G while integrating the latest power-saving and performance-enhancing technology. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by forced-air cooling. A second version with sidewall heat exchangers increased by half an inch on each side provides increased cooling capacity over the basic version. A third version with heat exchangers with twenty percent more surface area than the second version increases the cooling capacity even more.
An optional memory module bay can be added to the top of the XPand4200 unit, which supports a removable SATA Solid-State Drive (SSD) flash memory module. An optional front-panel USB port provides system monitoring and maintenance capabilities. X-ES maximizes power supply performance, supporting up to 200 W from a MIL-STD-704 28 VDC or 115 VAC input, as well as internal EMI filtering and holdup for up to 60 ms at 200 W.
Depending on your processing requirements, systems based on the XPand4200 Series can be populated with high-performance, low-power, conduction-cooled, 3U VPX or 3U cPCI modules designed and manufactured by X-ES. X-ES also has an extensive lineup of conduction-cooled XMC and PMC solutions to fulfill your data-processing and I/O requirements. Additionally, X-ES provides integration services for third-party modules.
Please contact X-ES sales to begin designing a system that will meet and exceed your I/O, processing, and power requirements.
