The XPedite5330 is a conduction- or air-cooled 3U CompactPCI (cPCI)single board computer based on the NXP (formerly Freescale) PowerQUICC™ III MPC8572E processor. With dual PowerPC e500 cores running at up to 1.5 GHz, the MPC8572E delivers enhanced performance and efficiency for today’s network information processing and other embedded computing applications.
Complementing processor performance, the XPedite5330 features two separate channels of up to 2 GB each of DDR2-667/800 ECC SDRAM, multiple PCI Express interfaces, XMC/PrPMC support, up to 256 MB of NOR flash(with redundancy), and up to 4 GB of NAND flash. Two Gigabit Ethernet ports, two RS-232/422/485 ports, and P14 I/O from the PrPMC are routed to J2 for additional system flexibility.
The XPedite5330 provides a high-performance, feature-rich solution for current and future generations of embedded applications. Operating system support packages for the XPedite5330 include Wind River VxWorks,Linux, QNX Neutrino, and Green Hills INTEGRITY.
Technical Specs
Processor
- NXP (formerly Freescale) PowerQUICC™ III MPC8572E processor
- Dual PowerPC e500 cores at up to 1.5 GHz
- 1 MB of shared L2 cache
Memory
- Up to 4 GB (2 GB each) of DDR2-800 ECC SDRAM in two channels
- Up to 256 MB of NOR flash (with redundancy)
- Up to 4 GB of NAND flash
J1 cPCI Interface
- 32-bit PCI interface operating at 33 or 66 MHz
- System controller capable with onboard clocking and arbitration
- Peripheral slot capable
J2 cPCI Interface
- Two 10/100/1000BASE-T Ethernet ports
- Two RS-232/422/485 serial ports
- PrPMC P14 I/O
- Four GPIO signals
XMC/PrPMC Site
- 32-bit, 66 MHz PCI bus (PMC interface)
- x4 PCIe port (XMC interface)
Front Panel I/O
- Front panel dual RJ-45 Ethernet and micro-DB-9 RS-232 serial ports available via optional plugover module
Software
- Linux BSP
- Wind River VxWorks BSP
- QNX Neutrino BSP
- Green Hills INTEGRITY BSP
Physical Characteristics
- 3U CompactPCI conduction- or air-cooled form factor
- Dimensions: 100 mm x 160 mm
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 3, 5
- Conformal coating available as an ordering option
Power Requirements
- Maximum power consumption: 27 W (with 1.5 GHz processor), 24 W (with 1.333 GHz processor)
Documentation
Datasheet
To view all of the information about this product in a PDF, please download the datasheet.
Download Datasheet
Technical Documents
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