XCalibur5090

The XCalibur5090 is a high-performance, reconfigurable, conduction-cooled 6U LRM module based on the AMD (formerly Xilinx) Virtex-7 family of FPGAs. With a pair of Virtex-7 FPGA, high-speed serial interfaces, DAC and ADC channels, external memory, and flexible, high-density I/O, the XCalibur5090 is ideal for customizable, high-bandwidth, signal-processing applications.

The XCalibur5090 utilizes four AD9739 and two ADC12D1600RF to provide four channels of high-frequency 14-bit Digital Analog Conversion (DAC) at 2500 Mbps and four channels of 12-bit Analog Digital Conversion (ADC) at 1600 Mbps for high-performance Digital Signal Processing (DSP), which can also be used as two channels at 3200 Mbps.

The XCalibur5090 provides a high-performance, feature-rich solution capable of interfacing to and processing streaming data from a wide variety of sensors. The X-ES FPGA Development Kit (FDK) is provided to support the requirements of high-performance, real-time, embedded streaming data applications and simplify FPGA development. It includes IP blocks, example FPGA designs, and software to control and communicate with FPGAs.

Features

• Two AMD (formerly Xilinx) Virtex-7 XC7VX690T FPGAs
• Up to 1 GB of DDR3 SDRAM per FPGA in two channels
• Non-volatile FPGA configuration flash
• 128 MB of user NOR flash per FPGA
• Conduction-cooled 6U LRM form factor
• Four 14-bit 2500 MSPS AD9739 DAC
• Two dual-channel 12-bit 3200 MSPS ADC12D1600RF ADC
• 234 single-ended FPGA interconnects
• Eight high-speed serial FPGA interconnects
• 28 FPGA GPO to the backplane
• 51 FPGA GPI from the backplane
• 17 FPGA GPIO to the backplane
• FPGA Development Kit (FDK)

Technical Specs

FPGA

• Dual AMD (formerly Xilinx) Virtex-7 for high-performance logic and DSP applications
• Up to 1 GB of DDR3 SDRAM per FPGA in two channels
• 128 MB of user NOR flash per FPGA
• x8 GTX interconnect between FPGAs
• 234 single-ended interconnect between FPGA

Supported FPGAs

• Virtex-7 XC7VX690T
• Support for commercial and industrial temperature as well as -1, -2, -3 speed grades

Development Support

• X-ES FPGA Development Kit (FDK)

LRM Backplane I/O

• x1 GTX
• 28 3.3 V CMOS from FPGA
• 51 3.3 V CMOS to FPGA
• 17 3.3 V CMOS GPIO to FPGA
• x1 RF REFCLK input
• x4 RF ADC inputs
• x4 RF DAC outputs

Additional Features

• Debug access connector
• Debug LEDs
• JTAG
• x10 1.8 V GPIO to FPGA

Physical Characteristics

• 6U LRM conduction-cooled form factor
• Dimensions: 233 mm x 164 mm
• 0.8 in. pitch without solder-side cover
• 0.85 in. and 1.0 in. pitch with solder-side cover

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

• Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
• Conformal coating available as an ordering option

Power Requirements

• Power will vary based on configuration and usage. Please consult factory.

Accessories

• XTend210 (90071260) - Debug Module for FPGA Cards
• XTend404 (90072670) - Debug Breakout for XCalibur5090
• XPand1023 (90072470) - 6U Development Platform for XCalibur5090

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

Download Datasheet

Technical Documents

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