XPedite2402

The XPedite2402 is a high-performance, reconfigurable, conduction- or air-cooled XMC module based on the user-programmable AMD (formerly Xilinx) Virtex-7 family of FPGAs. With dual x8 PCI Express Gen3 interfaces, external memory, and twelve high-speed fiber-optic transceivers, the XPedite2402 is ideal for customizable, high-bandwidth, data-processing applications.

The XPedite2402 incorporates 12 fiber-optic transceivers. Each transceiver is driven directly by an FPGA high-speed serial (HSS) link and gives the developer full control over data protocols such as Aurora, Serial FPDP (sFPDP), Fibre Channel, Infiniband, and Gigabit Ethernet. The fiber-optic transceivers utilize multi-fiber MT connectors, which can easily be connected to the backplane (VITA 66).

The XPedite2402 is designed to be a user-programmable FPGA resource, using the powerful Virtex-7 690T FPGA to support high-performance signal processing, sensor I/O, data recording, and linking systems in a range of protocols.

X-ES’ Firmware Development Kit (FDK) includes IP blocks, HDL, Test Benches, Linux drivers, and complete example designs for the XPedite2402.

Features

• AMD (formerly Xilinx) Virtex-7 FPGA XC7VX690T
• Conduction- or air-cooled XMC module
• Twelve 10.3125 Gb/s optical transceiver links
• Up to 8 GB of DDR3 SDRAM in two channels
• Front panel I/O using MTP/MPO
• Non-volatile FPGA SPI configuration flash
• Linux support

Technical Specs

FPGA

• AMD (formerly Xilinx) Virtex-7 690T for high-performance logic and DSP applications

Supported FPGAs

• Virtex-7 XC7VX690T
• Support for commercial and industrial temperature as well as -2, -3 speed grades

Memory

• Up to 8 GB of DDR3 SDRAM in two 64-bit channels

P15

• x8 PCI Express Gen3 port

P16

• 18 differential LVDS user I/O
• Two single-ended user I/O
• x8 GTH transceivers
• Can be used as x8 PCI Express Gen3 port

Front Panel I/O

• Dual multi-fiber ribbons with MTP/MPO connectors

Software

• Linux support
• X-ES' Firmware Development Kit (FDK)

Physical Characteristics

• XMC conduction- or air-cooled form factor
• Dimensions: 149 mm x 74 mm

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

• Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
• Conformal coating available as an ordering option

Power Requirements

• Power will vary based on configuration and usage. Please consult factory.

Accessories

• XTend210 (90071260) - Debug Module for FPGA Cards
• XTend3100 (90050115) - Dual XMC/PrPMC Carrier for Development and Testing

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

Download Datasheet

Technical Documents

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