Products
Overview
Showing 166–180 of 331 results
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XPand9004
Form Factor: Custom
Chassis Type: Custom
Number of Slots: 1
Dimensions: 5.8"L x 3.5"W x 1.1"H
Chassis Cooling: Natural Convection-CooledSolid-State Drive Module Development System
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XPand1405
Form Factor: COM Express®, PCIe Edge Card
Chassis Type: Development
Number of Slots: 1
Dimensions: 19.3"L x 15.43"W x 8.15"H
Chassis Cooling: Forced Convection-CooledDevelopment Platform for X-ES COM Express® Basic (Type 7) Modules
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XPand1404
Form Factor: COM Express®, PCIe Edge Card
Chassis Type: Development
Number of Slots: 1
Dimensions: 19.3"L x 15.43"W x 8.15"H
Chassis Cooling: Forced Convection-CooledDevelopment Platform for X-ES COM Express® Basic (Type 7) Modules
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XPand1400 Series
Form Factor: COM Express®, PCIe Edge Card, PMC, XMC
Chassis Type: Development
Number of Slots: 2
Dimensions: 21.5"L x 9"W x 20.5"H
Chassis Cooling: Forced Convection-CooledDevelopment Platform For XPand6000 Series, X-ES COM Express® Modules, and XMC/PMC Modules
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XPand1303
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.6"L x 13.5"W x 13.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX Development Platform for Up to Eight Air-Cooled Modules
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XTend2001
Form Factor: XMC
Chassis Type: Development
Number of Slots: 2
Dimensions: 6.55"L x 3.95"W x 0.83"H
Chassis Cooling: Forced Convection-CooledDual-XMC Carrier for Development and Testing
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XPand1205
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.5"L x 5.5"W x 16.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
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XPand1203
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.5"L x 5.5"W x 16.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
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XPand1015
Form Factor: 6U VPX
Chassis Type: Development
Number of Slots: 2
Dimensions: 17.5"L x 5.6"W x 9.3"H
Chassis Cooling: Conduction-CooledTwo-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
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XPand1011
Form Factor: 6U VPX
Chassis Type: Development
Number of Slots: 2
Dimensions: 17.5"L x 5.6"W x 9.3"H
Chassis Cooling: Forced Convection-CooledTwo-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
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XPort6197
Form Factor: Custom
Interface: 2 x4 PCI Express
Media Type: Solid-State Drive (SSD)
Media Max. Size: 2 TBSmall Form Factor (SFF) Removable NVM Express Dual Solid-State Drive (SSD) with 2 TB Capacity
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XPort6196
Form Factor: Custom
Interface: 1 SATA 6 Gb/s
Media Type: Solid-State Drive (SSD)
Media Max. Size: 2 TBSmall Form Factor (SFF) 2 TB Removable SATA Solid-State Drive (SSD)
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XPort6193
Status: End of Life (EOL)
Form Factor: Custom
Interface: 1 SATA 3 Gb/s
Media Type: Solid-State Drive (SSD)
Media Max. Size: 512 GBSmall Form Factor (SFF) 512 GB Removable SATA Solid-State Drive (SSD) with 256-bit Encryption
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XPort6176
Form Factor: 3U VPX
Interface: 2 x4 PCI Express
Media Type: Solid-State Drive (SSD)
Media Max. Size: 2 TB3U VPX NVM Express® Solid-State Drive (SSD) with Self-Encrypting Drive (SED) Technology
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XPedite2600
Status: Not Recommended for New Designs (NRND)
Form Factor: XMC
Processor: AMD (formerly Xilinx) Zynq® UltraScale+™ XCZU11EG
Memory: 16 GB DDR4
Ethernet: 1 10/100/1000BASE-T, 2 1000BASE-X
USB: 2 USB 2.0
Serial: 2 RS-232/422/485, 8 High-Speed Serial
LVDS I/O: 41 PairsAMD (formerly Xilinx) Zynq® UltraScale+™ MPSoC-Based Conduction- or Air-Cooled XMC Module