Products
Overview
Showing 166–180 of 331 results
-
XPand1405
Form Factor: COM Express®, PCIe Edge Card
Chassis Type: Development
Number of Slots: 1
Dimensions: 19.3"L x 15.43"W x 8.15"H
Chassis Cooling: Forced Convection-CooledDevelopment Platform for X-ES COM Express® Basic (Type 7) Modules
-
XPand1404
Form Factor: COM Express®, PCIe Edge Card
Chassis Type: Development
Number of Slots: 1
Dimensions: 19.3"L x 15.43"W x 8.15"H
Chassis Cooling: Forced Convection-CooledDevelopment Platform for X-ES COM Express® Basic (Type 7) Modules
-
XPand1400 Series
Form Factor: COM Express®, PCIe Edge Card, PMC, XMC
Chassis Type: Development
Number of Slots: 2
Dimensions: 21.5"L x 9"W x 20.5"H
Chassis Cooling: Forced Convection-CooledDevelopment Platform For XPand6000 Series, X-ES COM Express® Modules, and XMC/PMC Modules
-
XTend2001
Status: End of Life (EOL)
Form Factor: XMC
Chassis Type: Development
Number of Slots: 2
Dimensions: 6.55"L x 3.95"W x 0.83"H
Chassis Cooling: Forced Convection-CooledDual-XMC Carrier for Development and Testing
-
XPand1205
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.5"L x 5.5"W x 16.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
-
XPand1203
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.5"L x 5.5"W x 16.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
-
XPand1015
Form Factor: 6U VPX
Chassis Type: Development
Number of Slots: 2
Dimensions: 17.5"L x 5.6"W x 9.3"H
Chassis Cooling: Conduction-CooledTwo-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
-
XPort6197
Form Factor: Custom
Interface: 2 x4 PCI Express
Media Type: Solid-State Drive (SSD)
Media Max. Size: 2 TBSmall Form Factor (SFF) Removable NVM Express Dual Solid-State Drive (SSD) with 2 TB Capacity
-
XPort6196
Form Factor: Custom
Interface: 1 SATA 6 Gb/s
Media Type: Solid-State Drive (SSD)
Media Max. Size: 2 TBSmall Form Factor (SFF) 2 TB Removable SATA Solid-State Drive (SSD)
-
XPort6193
Status: End of Life (EOL)
Form Factor: Custom
Interface: 1 SATA 3 Gb/s
Media Type: Solid-State Drive (SSD)
Media Max. Size: 512 GBSmall Form Factor (SFF) 512 GB Removable SATA Solid-State Drive (SSD) with 256-bit Encryption
-
XPort6176
Form Factor: 3U VPX
Interface: 2 x4 PCI Express
Media Type: Solid-State Drive (SSD)
Media Max. Size: 2 TB3U VPX NVM Express® Solid-State Drive (SSD) with Self-Encrypting Drive (SED) Technology
-
XPedite2600
Status: End of Life (EOL)
Form Factor: XMC
Processor: AMD (formerly Xilinx) Zynq® UltraScale+™ XCZU11EG
Memory: 16 GB DDR4
Ethernet: 1 10/100/1000BASE-T, 2 1000BASE-X
USB: 2 USB 2.0
Serial: 2 RS-232/422/485, 8 High-Speed Serial
LVDS I/O: 41 PairsAMD (formerly Xilinx) Zynq® UltraScale+™ MPSoC-Based Conduction- or Air-Cooled XMC Module
-
XPedite2770
Form Factor: 3U VPX
Processor: AMD (formerly Xilinx) Versal® Prime VM1402 ACAP
Memory: 16 GB LPDDR4
Ethernet: 2 10/100/1000BASE-T, 2 10GBASE-R
Serial: 1 High-Speed Serial, 1 RS-232/422/485
LVDS I/O: 14
Single-Ended I/O: 16AMD (formerly Xilinx) Versal® Prime VM1402 ACAP-Based 3U VPX Module with 16 GB of LPDDR4, PCIe Gen3, and SecureCOTS™
-
XPedite2570
Form Factor: 3U VPX
Processor: AMD (formerly Xilinx) Kintex® UltraScale™ XCKU115
Memory: 8 GB DDR4
Serial: 2 High-Speed Serial
LVDS I/O: 44 Pairs
Single-Ended I/O: 10
Optical Transmitters: 12
Optical Receivers: 123U VPX AMD (formerly Xilinx) Kintex® UltraScale™ FPGA-Based Fiber-Optic I/O Module
-
XPedite2500
Form Factor: XMC
Processor: AMD (formerly Xilinx) Kintex® UltraScale™ XCKU115
Memory: 8 GB DDR4
Serial: 8 High-Speed Serial
LVDS I/O: 45 PairsAMD (formerly Xilinx) Kintex® UltraScale™ FPGA-Based Conduction- or Air-Cooled XMC Module