Products
Overview
Showing 256–270 of 329 results
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XPm2120
Status: End of Life (EOL)
Form Factor: 3U VPX
Input Voltage: MIL-STD-704 28 VDC
Max Output Power: 300 W
Max Current on 12 V: 25 A
Max Current on 5 V: 40 A
Max Current on 3.3 V: 20 A
Max Current on -12 V: 2 AMIL-STD-704, 28 V Input to ±12 V, 5 V, and 3.3 V Output, VITA 62.0, 3U VPX Power Supply with Integrated MIL-STD-461E Filtering
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XPedite2300
Status: End of Life (EOL)
Form Factor: XMC
Processor: AMD (formerly Xilinx) Virtex-6
Memory: 1 GB DDR3
Serial: 4 High-Speed Serial
LVDS I/O: 22 PairsVirtex-6 FPGA-Based Conduction- or Air-Cooled XMC Module
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XPand4200 Series
Status: End of Life (EOL)
Form Factor: 3U cPCI, 3U VPX
Ethernet: Dependent on Configuration
USB: Dependent on Configuration
Serial: Dependent on Configuration
Chassis Type: Sub-½ ATR
Number of Slots: 6
Dimensions: 13.5"L x 4.88"W x 6.0"H
Chassis Cooling: Forced Convection-CooledSub-½ ATR Forced Air-Cooled Chassis for Conduction-Cooled Modules
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XPand3200 Series
Status: End of Life (EOL)
Form Factor: 3U cPCI, 3U VPX
Ethernet: Dependent on Configuration
USB: Dependent on Configuration
Serial: Dependent on Configuration
Chassis Type: Sub-½ ATR
Number of Slots: 6
Dimensions: 8.75"L x 4.88"W x 5.62"H
Chassis Cooling: Conduction-CooledSub-½ ATR, Conduction-Cooled Chassis for Conduction-Cooled Modules
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XAct3000
Status: End of Life (EOL)
Form Factor: 3U VPX
Ethernet: 2 10/100/1000BASE-T
Serial: 2 RS-232
Chassis Type: Sub-½ ATR
Number of Slots: 4
Dimensions: 10.30"L x 4.88"W x 5.65"H
Chassis Cooling: Conduction-Cooled, Natural Convection-CooledSub-½ ATR, Natural Convection- or Conduction-Cooled Network Attached Storage (NAS) System with up to 3.5 TB of Storage
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XPm2020
Form Factor: 3U VPX
Input Voltage: MIL-STD-704 28 VDC
Max Output Power: 300 W
Max Current on 12 V: 8.3 A
Max Current on 5 V: 22 A
Max Current on 3.3 V: 20 A
Max Current on -12 V: 1.5 AMIL-STD-704 28 V Input to ±12 V, 5 V, and 3.3 V Output VITA 62.0 3U VPX Power Supply with Integrated MIL-STD-461E/F Filtering
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XPort3300
Status: End of Life (EOL)
Form Factor: XMC
Ethernet: 2 SFP+Air-Cooled XMC with Dual 10 Gigabit Ethernet SFP+ Interfaces
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XPort3200
Status: End of Life (EOL)
Form Factor: PMC, XMC
Ethernet: 2 10/100/1000BASE-T
Serial: 2 RS-232/422/485Freescale QorIQ P1020 Processor-Based Conduction- or Air-Cooled XMC/PMC IEEE 1588v2 Grandmaster Clock Module
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XPm2010
Form Factor: 3U cPCI
Input Voltage: MIL-STD-704 28 VDC
Max Output Power: 300 W
Max Current on 12 V: 8.3 A
Max Current on 5 V: 22 A
Max Current on 3.3 V: 25 A
Max Current on -12 V: 2 AMIL-STD-704 28 V Input to ±12 V, 5 V, and 3.3 V Output 3U PICMG 2.11 Power Supply with Integrated MIL-STD-461E Filtering
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XPand9001
Status: End of Life (EOL)
Form Factor: Custom
Chassis Type: Custom
Number of Slots: 1
Dimensions: 5.8"L x 3.5"W x 1.1"H
Chassis Cooling: Natural Convection-CooledXPort6192 Solid-State Drive (SSD) Module Development System
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XPand1301
Status: End of Life (EOL)
Form Factor: 3U cPCI
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.6"L x 13.5"W x 13.5"H
Chassis Cooling: Forced Convection-Cooled3U CompactPCI Development Platform for Up to Eight Air-Cooled Modules
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XPand1300
Status: Not Recommended for New Designs (NRND)
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.6"L x 13.5"W x 13.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX Development Platform for Up to Eight Air-Cooled Modules
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XPand1202
Status: End of Life (EOL)
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.5"L x 5.5"W x 16.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX VITA 67 Development Platform for Conduction-Cooled RF Modules and Intel® Core™ i7 Processor-Based Module