Products
Overview
Showing 286–300 of 340 results
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XPedite5201
Status: End of Life (EOL)
Form Factor: PMC, XMC
Processor: NXP PowerQUICC™ III MPC8548E
Memory: 4 GB DDR2
Ethernet: 2 10/100/1000BASE-T
Serial: 2 RS-232NXP PowerQUICC™ III MPC8548E Processor-Based Conduction-Cooled XMC/PMC Module
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XPedite5200
Status: Not Recommended for New Designs (NRND)
Form Factor: PMC, XMC
Processor: NXP PowerQUICC™ III MPC8548E
Memory: 4 GB DDR2
Ethernet: 4 10/100/1000BASE-T
Serial: 3 RS-232NXP MPC8548E PowerQUICC™ III based XMC/PrPMC Module with Dual Gigabit Ethernet
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XPedite5102
Status: End of Life (EOL)
Form Factor: XMC
Processor: NXP PowerPC MPC8640D
Memory: 4 GB DDR2
Ethernet: 2 10/100/1000BASE-T
Serial: 2 RS-232/422/485NXP MPC8640D Dual-Core Processor-Based Short-Form XMC Module with Dual Gigabit Ethernet
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XPedite5101
Status: End of Life (EOL)
Form Factor: PMC, XMC
Processor: NXP PowerPC MPC8640D
Memory: 4 GB DDR2
Ethernet: 2 10/100/1000BASE-T
Serial: 1 RS-232, 2 RS-232/422/485NXP MPC8640D Processor-Based Conduction- or Air-Cooled XMC/PMC Mezzanine Module
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XPand1004
Status: End of Life (EOL)
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 2
Dimensions: 11.9"L x 5.6"W x 9.3"H
Chassis Cooling: Forced Convection-CooledTwo-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
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XPand1003
Status: End of Life (EOL)
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 2
Dimensions: 8.3"L x 4.2"W x 8.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX Two-Slot Conduction-Cooled Development Platform
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XPand1000
Status: End of Life (EOL)
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 2
Dimensions: 8.3"L x 4.2"W x 8.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX Two-Slot Conduction-Cooled Development Platform
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CDP-5940
Status: End of Life (EOL)
Form Factor: 3U cPCI
Chassis Type: Development
Number of Slots: 2
Dimensions: 8.3"L x 4.2"W x 8.5"H
Chassis Cooling: Forced Convection-CooledDevelopment Platform for Mobile Ad Hoc Networks based on Cisco® CDP-5940 Router
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ADP
Status: End of Life (EOL)
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 10
Dimensions: 11.5"L x 5.5"W x 16.5"H
Chassis Cooling: Forced Convection-CooledAvionics Development Platform
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XChange3012
Status: Not Recommended for New Designs (NRND)
Form Factor: 3U VPX
Ethernet: 4 10/100/1000BASE-T, 8 1000BASE-X
Serial: 1 RS-2323U VPX PCI Express and Gigabit Ethernet Integrated Switch with XMC Support
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XTend4010
Status: End of Life (EOL)
Form Factor: 3U cPCI, 3U VPXNine-Slot 3U VPX/cPCI Hybrid Backplane
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XTend3130
Status: End of Life (EOL)
Form Factor: 3U cPCI3U cPCI Backplane
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XPand6904 Development Kit
Status: End of Life (EOL)
Form Factor: Custom
Dimensions: 7.96"L x 5.46"W x 1.42"H
Type: Development KitRapid-Prototyping Development Kit for the XPand6904 Rugged System
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XPand6200 Series Development Kit
Form Factor: 3U VPX
Chassis Type: Custom
Number of Slots: 2
Dimensions: 7.8"L x 3.4"W x 5.2"H
Chassis Cooling: Forced Convection-Cooled
Type: Development KitRapid Prototyping Development Kit for the XPand6200 Series Rugged Systems
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XPort6102
Status: End of Life (EOL)
Form Factor: XMC
Interface: 1 SATA 3 Gb/s, 1 x1 PCI Express
Media Type: Solid-State Drive (SSD)
Media Max. Size: 80 GBXMC Solid-State Drive (SSD) Storage Solution